Product Development Process 產品開發流程
Form No.
PDP-20211102-0002
Workflow Chart
Subject
PQR-678-AA CMP speed and time improve prevention over polishing miss operation
Apply Time
2021-11-02 11:07:03
End Time
2021-11-26 08:45:22
Status
Effective
Evaluate
Scan
BIST
Function
DDR
SATA
PLL
PCIE
Display
TD
CB
Impact
Temp
Slot
Memory
Power
Clock
ALPG
BIB
HPBSC
HPB5B
LC1
George Washington : Gate Oxide Breakdown.pdf
George Washington : ION IMPLANTATION IN SEMICONDUCTORS.pdf
George Washington : Ion_Implantation_in_Semiconductors.pdf
George Washington : Ion_Implantation_in_Silicon_Technology.pdf
Process Engineer
Equipment
Furnace
PCVD
CMP
IMP
Coater
Scaner
Developer
DryEtching
WetStation
Scrubber
John Adams : Metallization - Aluminum technology.pdf
John Adams : Metallization - Copper technology.pdf
Product Engineer
Layer
GateOxide
Metal1
Metal2
CVD
WetStation
Copper
Scrubber
Photo
DryEtching
IMP
George Walker Bush : Metallization - Metal semiconductor junction.pdf
George Walker Bush : Metallization - Requirements on metallization.pdf