Product Development Process 產品開發流程
Form No.
PDP-20211105-0002
Workflow Chart
Subject
BCD-890-AA comparison between conventional Al interconnect and Cu-dual damascene
Apply Time
2021-11-05 09:38:12
End Time
2021-11-24 09:55:08
Status
Termination
Evaluate
Scan
BIST
Function
DDR
SATA
PLL
PCIE
Display
TD
CB
Impact
Temp
Slot
Memory
Power
Clock
ALPG
BIB
HPBSC
HPB5B
LC1
George Washington : Wafer fabrication - Wafer fabrication.pdf
George Washington : Wet chemistry - Etch processes.pdf
George Washington : Wet chemistry - Wafer cleaning.pdf
Process Engineer
Equipment
Furnace
PCVD
CMP
IMP
Coater
Scaner
Developer
DryEtching
WetStation
Scrubber
Product Engineer
Layer
GateOxide
Metal1
Metal2
CVD
WetStation
Copper
Scrubber
Photo
DryEtching
IMP
William Jefferson Clinton : Wet chemistry - Wet etching.pdf